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1

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Lau, John H., Li, Ming, Li, Qingqian Margie, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Yong, Qing Xiang, Cheng, Zhong, Wee, Koh Sau, Beica, Rozalia, Ko, C. T., Lim, Sze Pei, Fan, Nelson, Kuah, E

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 4.50 MB

english, 2018

2

Upgrading programme in public housing: an assessment of price and liquidity enhancements

Lum, Sau Kim, Koh, Tilin, Ong, Seow‐Eng

Journal:

Journal of Property Research

Year:

2004

Language:

english

File:

PDF, 307 KB

english, 2004

3

The Potential of Mesenchymal Stromal Cell as Therapy in Neonatal Diseases

Liau, Ling Ling, Al-Masawa, Maimonah Eissa, Koh, Benson, Looi, Qi Hao, Foo, Jhi Biau, Lee, Sau Har, Cheah, Fook Choe, Law, Jia Xian

Journal:

Frontiers in Pediatrics

Year:

2020

File:

PDF, 1.65 MB

2020

4

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dynamic thermal simulation of high brightness LEDs with unsteady driver power output

Ye, H., Koh, Sau, Wei, J., vanZeijl, H. W., Zhang, G. Q.

Year:

2012

Language:

english

File:

PDF, 1.03 MB

english, 2012

5

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - SiC MOSFET Threshold-Voltage Instability Under High Temperature Aging

Liu, Yang, Chen, Xianping, Zhao, ZhaoHui, Li, ZhiGang, Lu, CaiTao, Zhang, JingGuo, Ye, Huaiyu, Koh, Sau Wee, Wang, LiGen, Zhang, Guoqi

Year:

2018

Language:

english

File:

PDF, 6.77 MB

english, 2018

6

Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

Cai, Miao, Yang, Daoguo, Huang, Jianlin, Zhang, Maofen, Chen, Xianping, Liang, Caihang, Koh, Sau, Zhang, Guoqi

Journal:

IEEE Photonics Journal

Year:

2017

Language:

english

File:

PDF, 1.27 MB

english, 2017

7

Degradation Mechanisms of Mid-Power White-Light LEDs Under High-Temperature–Humidity Conditions

Huang, Jianlin, Golubovic, Dusan S, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, X. J., Zhang, G. Q.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 1.47 MB

english, 2015

8

[IEEE 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - Clear Water Bay, Hong Kong (2018.12.17-2018.12.20)] 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - ILD Interlaminar Strength Evaluation for WLCSP

LI, Weiqiang, Wang, Yueqi, Wee, Koh Sau, Zhang, Fuwei

Year:

2018

Language:

english

File:

PDF, 1.29 MB

english, 2018

9

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Thermal and moisture degradation in SSL system

Koh, Sau, Driel, Willem VD, Zhang, G.Q.

Year:

2012

Language:

english

File:

PDF, 1.76 MB

english, 2012

10

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A numerical analysis of crack growth and morphology evolution in chip-to-packages nano-interconnections

Sau Koh,, Rao Tummala,, Saxena, Ashok, Selvam, P.

Year:

2008

Language:

english

File:

PDF, 497 KB

english, 2008

11

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Buckling analysis of carbon nanotubes and the influence of defect position

Poelma, R.H., Sadeghian, H., Sau Koh,, Zhang, G.Q.

Year:

2011

Language:

english

File:

PDF, 1.48 MB

english, 2011

12

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Material characterization for nano wafer level packaging application

Sau Koh,, Ranjan Rajoo,, Rao Tummala,, Ashok Saxena,, Kuo Tsing Tsai,

Year:

2005

Language:

english

File:

PDF, 596 KB

english, 2005

13

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - The performance of sintered nanocopper interconnections for high temperature device

Liu, Qipeng, Chen, Xianping, Zhu, Jie, Zhang, HuanKun, Zhang, Jiang Song, Zhang, Jing Guo, Wang, Li Gen, Ye, Huaiyu, Koh, Sau Wee, Zhang, G.O., Zhang, Guoqi

Year:

2018

Language:

english

File:

PDF, 6.58 MB

english, 2018

14

[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - A DFT Model Study about Structure Sensitivity for Benzotriazole Adsorption on Copper Surfaces and Nano Cluster

Zhang, Weihong, Zhou, Quan, Tang, Honghao, Liu, Xu, Ye, Huaiyu, Koh, Sau Wee, zhang, Guoqi

Year:

2020

File:

PDF, 2.50 MB

2020

15

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Copper Interconnections for High Performance and Fine Pitch Flipchip Digital Applications and Ultra-Miniaturized RF Module Applications

Tummala, R.R., Raj, P.M., Aggarwal, A., Mehrotra, G., Sau Wee Koh,, Bansal, S., Tan Teck Tiong,, Ong, C.K., Chew, J., Vaidyanathan, K., Vempati Srinivasa Rao,

Year:

2006

Language:

english

File:

PDF, 1.76 MB

english, 2006

16

[IEEE 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - Clear Water Bay, Hong Kong (2018.12.17-2018.12.20)] 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - ILD Interlaminar Strength Evaluation for WLCSP

LI, Weiqiang, Wang, Yueqi, Wee, Koh Sau, Zhang, Fuwei

Year:

2018

File:

PDF, 1.29 MB

2018

17

A Circulating miRNA Signature for Stratification of Breast Lesions among Women with Abnormal Screening Mammograms

Loke, Sau Yeen, Munusamy, Prabhakaran, Koh, Geok Ling, Chan, Claire Hian Tzer, Madhukumar, Preetha, Thung, Jee Liang, Tan, Kiat Tee Benita, Ong, Kong Wee, Yong, Wei Sean, Sim, Yirong, Oey, Chung Lie,

Journal:

Year:

2019

File:

PDF, 1.53 MB

2019

18

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Investigation of lumen degradation mechanisms of mid-power LED by HAST

Huang, Jianlin, Koh, Sau, Li, Xiupeng, Zhang, Guoqi

Year:

2014

Language:

english

File:

PDF, 443 KB

english, 2014

19

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Location optimize of press-pack IGBT chip

Liu, Yang, Liu, Xu, Aori, Geli, Li, Jun, Ye, Huaiyu, Koh, Sau Wee, Zhang, Guoqi

Year:

2019

File:

PDF, 2.85 MB

2019

20

Rapid degradation of mid-power white-light LEDs in saturated moisture conditions

Huang, Jianlin, golubovic, Dusan, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, Xuejun, Zhang, Guoqi

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 4.01 MB

english, 2015

21

Nonlinear constitutive models from nanoindentation tests using artificial neural networks

Rami Haj-Ali, Hoan-Kee Kim, Sau Wee Koh, Ashok Saxena, Rao Tummala

Journal:

International Journal of Plasticity

Year:

2008

Language:

english

File:

PDF, 1.33 MB

english, 2008

22

Degradation of light emitting diodes: a proposed methodology

Koh, Sau, Driel, Willem Van, Zhang, G.Q

Journal:

Journal of Semiconductors

Year:

2011

Language:

english

File:

PDF, 293 KB

english, 2011

23

[IEEE 2014 11th China International Forum on Solid State Lighting (SSLCHINA) - Guangzhou, China (2014.11.6-2014.11.8)] 2014 11th China International Forum on Solid State Lighting (SSLCHINA) - Wireless-driven LED semiconductor lighting system

Zhan, Teng, Ma, Jun, Yi, Xiaoyan, Koh, Sau Wee, Wang, Junxi, Wu, Xinxin, Wang, Guohong, Li, Jinmin

Year:

2014

Language:

english

File:

PDF, 2.59 MB

english, 2014

24

Iron-Catalysed sp3–sp3 Cross-Coupling Reactions of Unactivated Alkyl Halides with Alkyl Grignard Reagents

Krishna G. Dongol, Huishi Koh, Manisankar Sau, Christina L. L. Chai

Journal:

Advanced Synthesis & Catalysis

Year:

2007

Language:

english

File:

PDF, 73 KB

english, 2007

25

Degradation modeling of mid-power white-light LEDs by using Wiener process

Huang, Jianlin, Golubović, Dušan S, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, Xuejun, Zhang, G.Q.

Journal:

Year:

2015

Language:

english

File:

PDF, 1.93 MB

english, 2015

26

SnSe monolayer: A promising candidate of SO2 sensor with high adsorption quantity

Ye, Huaiyu, Liu, Lian, Xu, Yixin, Wang, Lingyun, Chen, Xianping, Zhang, Kai, Liu, YuFei, Koh, Sau Wee, Zhang, Guoqi

Journal:

Applied Surface Science

Year:

2019

Language:

english

File:

PDF, 952 KB

english, 2019

27

Accelerated pre-coking of NiMo/γ-Al 2 O 3 catalyst: Effect on the hydroprocessing activity of vacuum residue

Kohli, K., Prajapati, R., Maity, Samir K., Sau, M., Sharma, Brajendra K.

Journal:

Year:

2019

Language:

english

File:

PDF, 1.49 MB

english, 2019

28

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method

Pham, Van-Lai, Niu, Yuling, Wang, Jing, Wang, Huayang, Singh, Charandeep, Park, Seungbae, Zhong, Cheng, Koh, Sau Wee, Wang, Jifan, Shao, Shuai

Year:

2018

Language:

english

File:

PDF, 6.80 MB

english, 2018

29

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

Bo Sun,, Xuejun Fan,, Lubing Zhao,, Yuan, C.A., Sau Wee Koh,, Guoqi Zhang,

Year:

2014

Language:

english

File:

PDF, 1.13 MB

english, 2014

30

[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties

Liu, Xu, Zhou, Quan, Liu, Qipeng, Tang, Honghao, Gao, Chenshan, Xie, Bin, Koh, Sau Wee, Ye, Huaiyu, Zhang, Guoqi

Year:

2020

File:

PDF, 4.58 MB

2020

31

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal analysis of phosphor in high brightness LED

Ye, H., Koh, Sau, Yuan, C.A., Zhang, G. Q.

Year:

2012

Language:

english

File:

PDF, 1.45 MB

english, 2012

32

Fe(II)-Catalyzed sp 3 -sp 3 Cross-Coupling Reactions

Dongol, K., Koh, H., Sau, M., Chai, C.

Journal:

Year:

2007

Language:

english

File:

PDF, 64 KB

english, 2007

33

Deactivation of hydrotreating catalyst by metals in resin and asphaltene parts of heavy oil and residues

Kohli, K., Prajapati, R., Maity, S.K., Sau, M., Garg, M.O.

Journal:

Year:

2016

Language:

english

File:

PDF, 2.32 MB

english, 2016

34

[IEEE 2013 10th China International Forum on Solid State Lighting (ChinaSSL) - Beijing, China (2013.11.10-2013.11.12)] 2013 10th China International Forum on Solid State Lighting (ChinaSSL) - An accelerated lifetime test method for DC or AC supplied electronic control gear for LED modules of outdoor LED lighting products

Bo Sun,, Yuan, C.A., Fan, X.J., Sau Wee Koh,, Zhang, G.Q.

Year:

2013

Language:

english

File:

PDF, 535 KB

english, 2013

35

A Circulating miRNA Signature for Stratification of Breast Lesions among Women with Abnormal Screening Mammograms

Loke, Sau Yeen, Munusamy, Prabhakaran, Koh, Geok Ling, Chan, Claire Hian Tzer, Madhukumar, Preetha, Thung, Jee Liang, Tan, Kiat Tee Benita, Ong, Kong Wee, Yong, Wei Sean, Sim, Yirong, Oey, Chung Lie,

Journal:

Year:

2019

Language:

english

File:

PDF, 1.53 MB

english, 2019

36

Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes

Ye, Huaiyu, Koh, Sau Wee, Yuan, Cadmus, van Zeijl, Henk, Gielen, Alexander W.J., Lee, Shi-Wei Ricky, Zhang, Guoqi

Journal:

Applied Thermal Engineering

Year:

2014

Language:

english

File:

PDF, 1.19 MB

english, 2014

37

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

Bo Sun,, Sau Wee Koh,, Yuan, Cadmus, Xuejun Fan,, Guoqi Zhang,

Year:

2013

Language:

english

File:

PDF, 944 KB

english, 2013

38

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Investigation of lumen degradation mechanisms of mid-power LED by HAST

Huang, Jianlin, Koh, Sau, Li, Xiupeng, Zhang, Guoqi

Year:

2014

Language:

english

File:

PDF, 443 KB

english, 2014

39

Mesoporous Alumina Supported NiMo Catalysts for Residue Conversion

Kohli, Kirtika, Prajapati, Ravindra, Sau, Madhusudan, Maity, Samir K.

Journal:

Procedia Earth and Planetary Science

Year:

2015

Language:

english

File:

PDF, 423 KB

english, 2015

40

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

Yuan, Cadmus, Jia Wei,, Huaiyu Ye,, Koh, Sau, Harianto, Stephen, van den Nieuwenhof, Monique, Zhang, G. Q.

Year:

2012

Language:

english

File:

PDF, 1.38 MB

english, 2012

41

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test

Huang, Jianlin, Golubović, Dušan S, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, Xuejun, Zhang, G.Q.

Journal:

Reliability Engineering & System Safety

Year:

2016

Language:

english

File:

PDF, 855 KB

english, 2016

42

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method

Pham, Van-Lai, Niu, Yuling, Wang, Jing, Wang, Huayang, Singh, Charandeep, Park, Seungbae, Zhong, Cheng, Koh, Sau Wee, Wang, Jifan, Shao, Shuai

Year:

2018

File:

PDF, 6.80 MB

2018

43

Investigating the Effect of 3D Simulation Based Learning on the Motivation and Performance of Engineering Students

Koh, Caroline, Tan, Hock Soon, Tan, Kim Cheng, Fang, Linda, Fong, Fook Meng, Kan, Dominic, Lye, Sau Lin, Wee, May Lin

Journal:

Journal of Engineering Education

Year:

2010

Language:

english

File:

PDF, 1.71 MB

english, 2010

44

Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation

Huang, Jianlin, Golubovic, Dusan S., Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, Xuejun, Zhang, Guoqi

Journal:

IEEE Transactions on Electron Devices

Year:

2016

Language:

english

File:

PDF, 2.10 MB

english, 2016

45

078 ACUTE KIDNEY INJURY REQUIRING RENAL REPLACEMENT THERAPY IN QUEEN ELIZABETH HOSPITAL

Rajan, Vinoth Kasi, Wong, Koh Wei, Chan, Fei Sia, Lau, Ron Hsien, Lo, Jason, Eh Sau, Thamron Keowani

Journal:

Kidney International Reports

Year:

2017

Language:

english

File:

PDF, 154 KB

english, 2017

46

Identification of Novel Breast Cancer Risk Loci

Chan, Claire Hian Tzer, Munusamy, Prabhakaran, Loke, Sau Yeen, Koh, Geok Ling, Wong, Edward Sern Yuen, Law, Hai Yang, Yoon, Chui Sheun, Tan, Min-Han, Yap, Yoon Sim, Ang, Peter, Lee, Ann Siew Gek

Journal:

Cancer Research

Year:

2017

Language:

english

File:

PDF, 776 KB

english, 2017

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